Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381398 | Method for manufacturing semiconductor apparatus | Fucheng Chen | 2019-08-13 |
| 10134698 | Bonding pad structure, bonding ring structure, and MEMS device packaging method | Fucheng Chen, Yao-Hong Liu | 2018-11-20 |