JC

Jin CHENG

S( Semiconductor Manufacturing International (Beijing): 1 patents #301 of 689Top 45%
S( Semiconductor Manufacturing International (Shanghai): 1 patents #561 of 1,122Top 50%
Overall (All Time): #4,143,201 of 4,157,543Top 100%
1
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10446519 Wafer bonding methods and wafer-bonded structures Lin Shi, Fu-Cheng Chen 2019-10-15