CL

Chang LIU

S( Semiconductor Manufacturing International (Beijing): 1 patents #301 of 689Top 45%
Overall (All Time): #3,100,520 of 4,157,543Top 75%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8697543 Chip-to-wafer bonding method and three-dimensional integrated semiconductor device Yunqi Sui 2014-04-15