Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6284570 | Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias | Mario Federico Cespedes Betran, Manuel Reyes, Miguel Angel Lopez Osorio, Luis Moreno Hagelsieb, Jose de Jesus De Hijar +2 more | 2001-09-04 |