Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694945 | Lead frame package having conductive surfaces | Ren Huei Tzeng | 2023-07-04 |
| 10971434 | Lead frame package having conductive surface with integral lead finger | Ren Huei Tzeng | 2021-04-06 |
| 10707147 | Clip for semiconductor package | — | 2020-07-07 |
| 10204844 | Clip for semiconductor package | — | 2019-02-12 |