Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387918 | Substrate processing apparatus and substrate processing method | Minyoung KIM | 2025-08-12 |
| 11600593 | Die bonding apparatus and method and substrate bonding apparatus and method | Jungsuk Goh, Kwangsup Kim, Doyeon KIM, Minyoung KIM, Jihoon Park +5 more | 2023-03-07 |