Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12077677 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component | Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Ryosuke Takahashi +3 more | 2024-09-03 |
| 11492528 | Heat dissipation sheet, method for producing heat dissipation sheet, and laminate | Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui | 2022-11-08 |
| 11459443 | Resin material, method for producing resin material, and laminate | Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara +1 more | 2022-10-04 |
| 11220604 | Method for manufacturing cured film, method for manufacturing electronic component, and electronic component | Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Ryosuke Takahashi +3 more | 2022-01-11 |
| 10477671 | Laminated body | Osamu Inui | 2019-11-12 |
| 9337019 | Method for manufacturing electronic component, and electronic component | Mitsuru Tanikawa, Takashi Watanabe, Michihisa Ueda, Shigeru Nakamura, Ryosuke Takahashi +2 more | 2016-05-10 |
| 7981511 | Hollow resin fine particles, organic/inorganic hybrid fine particles, and method for producing hollow resin fine particles | Michiya Nakagawa, Hiroyuki Nishimoto | 2011-07-19 |