TS

Tsuyoshi Shintate

SE Seiko Epson: 15 patents #1,253 of 7,774Top 20%
📍 Yokote, JP: #2 of 26 inventorsTop 8%
Overall (All Time): #324,451 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
8888229 Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate Koichi Mizugaki, Kazuaki Sakurada, Kenji Wada 2014-11-18
8322033 Method for forming a conductive post for a multilayered wiring substrate Toshimitsu Hirai, Jun Yamada 2012-12-04
7972651 Method for forming multi-layered structure, method for manufacturing wiring substrate, and method for manufacturing electronic apparatus Kazuaki Sakurada, Jun Yamada 2011-07-05
7871666 Pattern forming system, pattern forming method, and electronic apparatus Kazuaki Sakurada, Noboru Uehara 2011-01-18
7805836 Manufacturing method of electronic board and multilayer wiring board 2010-10-05
7793411 Method for manufacturing electronic substrate 2010-09-14
7767252 Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus Kazuaki Sakurada, Jun Yamada 2010-08-03
7723243 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus Toshiaki Mikoshiba, Kenji Wada, Kazuaki Sakurada, Jun Yamada 2010-05-25
7629019 Method for forming wiring pattern, wiring pattern, and electronic apparatus Kazuaki Sakurada, Noboru Uehara 2009-12-08
7541063 Method for forming layer Koichi Mizugaki, Jun Yamada 2009-06-02
7538031 Method of manufacturing a wiring substrate and an electronic instrument Noboru Uehara, Kazuaki Sakurada 2009-05-26
7462241 Pattern forming system, pattern forming method, and electronic apparatus Kazuaki Sakurada, Noboru Uehara 2008-12-09
7416759 Wiring pattern formation method, wiring pattern, and electronic device Kazuaki Sakurada, Noboru Uehara 2008-08-26
7316974 Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device Noboru Uehara, Kazuaki Sakurada 2008-01-08
7250377 Multi-layered structure forming method, method of manufacturing wiring substrate, and method of manufacturing electronic apparatus Toshiaki Mikoshiba, Kenji Wada, Kazuaki Sakurada, Jun Yamada 2007-07-31