TM

Takuya Miyakawa

SE Seiko Epson: 34 patents #402 of 7,774Top 6%
YA Yazaki: 1 patents #2,077 of 3,427Top 65%
Overall (All Time): #95,254 of 4,157,543Top 3%
35
Patents All Time

Issued Patents All Time

Showing 26–35 of 35 patents

Patent #TitleCo-InventorsDate
6299708 Carbide dispersed, strengthened copper alloy Takao Choh, Hirohiko Fujimaki, Yuji Nitta 2001-10-09
6221197 Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent Yoshiaki Mori, Yasutsugu Aoki 2001-04-24
6183883 Brazing or soldering material and manufacturing method therefor Yoshiaki Mori, Katsuhiro Takahashi, Yasushi Karasawa 2001-02-06
6180253 Brazing or soldering material and production method thereof Yoshiaki Mori, Katsuhiro Takahashi 2001-01-30
6158648 Method and apparatus for bonding using brazing material Yoshiaki Mori, Yasuhiko Asano, Osamu Kurashina, Satoshi Miyamori, Yohei Kurashima +1 more 2000-12-12
6086710 Surface treatment apparatus Takeshi Miyashita, Yasutugu Aoki, Isao Kubota, Osamu Kurashina, Yasuhiko Asano +2 more 2000-07-11
6051150 Plasma etching method and method of manufacturing liquid crystal display panel 2000-04-18
6006763 Surface treatment method Yoshiaki Mori, Katsuhiro Takahashi, Takeshi Miyashita, Satoru Katagami 1999-12-28
5918354 Method of making a piezoelectric element Yasumitsu Ikegami 1999-07-06
5735451 Method and apparatus for bonding using brazing material Yoshiaki Mori, Yasuhiko Asano, Osamu Kurashina, Satoshi Miyamori, Yohei Kurashima +1 more 1998-04-07