Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658325 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2020-05-19 |
| 10103120 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2018-10-16 |
| 9842821 | Semiconductor device including semiconductor chip, wiring, conductive material, and contact part | Masatoshi Tagaki | 2017-12-12 |
| 9515043 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2016-12-06 |
| 9331039 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2016-05-03 |
| 9093334 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2015-07-28 |
| 8952554 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2015-02-10 |
| 8878365 | Semiconductor device having a conductive layer reliably formed under an electrode pad | Masatoshi Tagaki | 2014-11-04 |
| 8742601 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2014-06-03 |
| 8614513 | Semiconductor device including a buffer layer structure for reducing stress | Masatoshi Tagaki | 2013-12-24 |
| 8441125 | Semiconductor device | Masatoshi Tagaki | 2013-05-14 |
| 7936064 | Semiconductor device | Masatoshi Tagaki | 2011-05-03 |
| 7598612 | Semiconductor device and manufacturing method thereof | — | 2009-10-06 |
| 7560814 | Semiconductor device that improves electrical connection reliability | Hideki Yuzawa, Michiyoshi Takano | 2009-07-14 |
| 7230338 | Semiconductor device that improves electrical connection reliability | Hideki Yuzawa, Michiyoshi Takano | 2007-06-12 |
| 7176581 | Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus | — | 2007-02-13 |
| 7037758 | Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus | Fumiaki Karasawa | 2006-05-02 |