Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5970320 | Process of resin sealing a semiconductor device and lead frame | Yasuo Yamasaki, Munenori Kurasawa, Nobuaki Hashimoto | 1999-10-19 |
| 5653891 | Method of producing a semiconductor device with a heat sink | Tetsuya Otsuki | 1997-08-05 |
| 5652461 | Semiconductor device with a convex heat sink | Tetsuya Ootsuki | 1997-07-29 |
| 5554885 | Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape | Yasuo Yamasaki, Munenori Kurasawa, Nobuaki Hashimoto | 1996-09-10 |