Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5312772 | Method of manufacturing interconnect metallization comprising metal nitride and silicide | Kenji Yokoyama, Juri Kato | 1994-05-17 |
| 4998157 | Ohmic contact to silicon substrate | Kenji Yokoyama, Juri Kato | 1991-03-05 |