MS

Masakuni Shiozawa

SE Seiko Epson: 15 patents #1,253 of 7,774Top 20%
📍 Sakata, JP: #9 of 74 inventorsTop 15%
Overall (All Time): #324,359 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
8816709 Electronic component testing device and electronic component transport method 2014-08-26
8558570 Component test apparatus and component transport method Hiroaki Fujimori 2013-10-15
8008939 Component test apparatus and component transport method Hiroaki Fujimori 2011-08-30
7888928 Component test apparatus having a pair of rotary transport hands Hiroaki Fujimori 2011-02-15
7562806 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device 2009-07-21
7410826 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device 2008-08-12
7371607 Method of manufacturing semiconductor device and method of manufacturing electronic device 2008-05-13
7256072 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device Akiyoshi Aoyagi 2007-08-14
7195935 Selective packaging of tested semiconductor devices 2007-03-27
7017636 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device 2006-03-28
6984125 Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device 2006-01-10
6638785 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making Tomoyuki Shindo 2003-10-28
6566763 Interconnect substrate, apparatus of applying adhesive material, semiconductor device, circuit board and electronic instrument 2003-05-20
6512294 Adsorbing device, sucker and mounting device for conductive member, adsorbing method and mounting method for conductive member, and semiconductor device and method of making the same Tomoyuki Shindo 2003-01-28
6391686 Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument 2002-05-21