KY

Kurashima Yohei

SE Seiko Epson: 2 patents #4,555 of 7,774Top 60%
Overall (All Time): #2,240,841 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6100496 Method and apparatus for bonding using brazing material Miyakawa Takuya, Mori Yoshiaki, Anan Makoto 2000-08-08
5831238 Method and apparatus for bonding using brazing material at approximately atmospheric pressure Miyakawa Takuya, Mori Yoshiaki, Anan Makoto 1998-11-03