Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4786545 | Circuit substrate and method for forming bumps on the circuit substrate | Sadasumi Uchiyama | 1988-11-22 |
| 4644445 | Resin mounting structure for an integrated circuit | — | 1987-02-17 |