Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12285896 | Injection molding device | Hidenobu MARUYAMA, Kenta ANEGAWA | 2025-04-29 |
| 11992988 | Injection molding apparatus | Hidenobu MARUYAMA, Yuta Sakai | 2024-05-28 |
| 10147621 | Adhesive tape separating tool, manufacturing apparatus of semiconductor chip, manufacturing apparatus of MEMS device manufacturing apparatus of liquid ejecting head, and separating method of adhesive tape | Akira Takada | 2018-12-04 |