Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10850519 | Liquid ejecting head and liquid ejecting apparatus | — | 2020-12-01 |
| 10603914 | MEMS device, liquid ejecting head, and liquid ejecting apparatus | Masashi Fujioka, Eiju Hirai, Isao Yanagisawa | 2020-03-31 |
| 9822452 | Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus | Tsuyoshi Yoda, Hiroshi Sugita | 2017-11-21 |
| 9708715 | Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus | Tsuyoshi Yoda, Shuichi Tanaka | 2017-07-18 |
| 8960861 | Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head | Tsuyoshi Yoda, Hiroshi Sugita | 2015-02-24 |
| 8960865 | Liquid droplet ejecting head and printing apparatus | — | 2015-02-24 |
| 7214615 | Method of manufacturing semiconductor device, semiconductor device, circuit substrate and electronic apparatus | — | 2007-05-08 |
| 7029937 | Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument | — | 2006-04-18 |
| 6873054 | Semiconductor device and a method of manufacturing the same, a circuit board and an electronic apparatus | Tadayoshi Ikehara | 2005-03-29 |
| 6841849 | Semiconductor device and method of manufacturing the same, circuit board and electronic instrument | — | 2005-01-11 |
| 6732907 | Soldering method, soldering device, and method and device of fabricating electronic circuit module | — | 2004-05-11 |
| 6730173 | Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module | — | 2004-05-04 |