Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7067423 | Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment | — | 2006-06-27 |
| 6995650 | Electrical part prevented from improper mounting on circuit board, and mounting structure for the electrical part | Hideyasu Hayashi | 2006-02-07 |
| 6924553 | Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same | — | 2005-08-02 |
| 6806556 | SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER HAVING BUMPS, SEMICONDUCTOR CHIP HAVING BUMPS AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT | — | 2004-10-19 |
| 6769459 | Method for making an elastic fabric for a damper and the structure thereof | — | 2004-08-03 |
| 5367393 | Electro-optical apparatus with metal light shield and conductor between color filters | Hiroshi Watanabe, Kunio Wanikawa | 1994-11-22 |
| 5317434 | Color filter structure for liquid crystal displays with seal end on or surrounded by orientation film | — | 1994-05-31 |
| 5119216 | Electro-optical device | Hiroshi Wada, Chiyoaki Iijima, Yoichi Momose | 1992-06-02 |