Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9325292 | Piezoelectric device with a package including a convex part | Katsuo Ishikawa | 2016-04-26 |
| 8723401 | Piezoelectric device with a package including a convex part | Katsuo Ishikawa | 2014-05-13 |
| 8643254 | Piezoelectric device with a package including a convex part | Katsuo Ishikawa | 2014-02-04 |
| 8248813 | Electronic device, electronic module, and methods for manufacturing the same | Atsushi Ono, Yoshihiro Kobayashi, Shojiro Kitamura, Masayuki Matsunaga | 2012-08-21 |
| 7933128 | Electronic device, electronic module, and methods for manufacturing the same | Atsushi Ono, Yoshihiro Kobayashi, Shojiro Kitamura, Masayuki Matsunaga | 2011-04-26 |
| 7859172 | Piezoelectric resonator, manufacturing method thereof and lid for piezoelectric resonator | Katsuo Ishikawa, Yukihiro Tonegawa | 2010-12-28 |
| 7714484 | Piezoelectric resonator and manufacturing method therefor | Katsuo Ishikawa, Yukihiro Tonegawa | 2010-05-11 |
| D580592 | Piezoelectric device | Katsuo Ishikawa, Yukihiro Tonegawa | 2008-11-11 |
| D580096 | Piezoelectric device | Katsuo Ishikawa, Yukihiro Tonegawa | 2008-11-04 |
| 6900076 | Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices | Tadashi Komiyama, Eiichi Sato | 2005-05-31 |
| 6566232 | Method of fabricating semiconductor device | Eiichi Sato | 2003-05-20 |
| 5498902 | Semiconductor device and its manufacturing method | — | 1996-03-12 |
| 5302850 | Semiconductor sealing mold | — | 1994-04-12 |
| 5077237 | Method of encapsulating a semiconductor element using a resin mold having upper and lower mold half resin inflow openings | — | 1991-12-31 |