Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10105794 | Method of forming a lead-free solder composition | John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves | 2018-10-23 |
| 9975207 | Lead-free solder composition | John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves | 2018-05-22 |
| 8771592 | Lead-free solder composition | John Pereira, Alexandra Mary Mackin, Joseph C. Gonsalves | 2014-07-08 |
| 6176947 | Lead-free solders | Zhenfeng Guo | 2001-01-23 |
| 5985212 | High strength lead-free solder materials | Holger J. Koenigsmann | 1999-11-16 |
| 5520752 | Composite solders | George K. Lucey, Jr., James A. Wasynczuk, Roger B. Clough | 1996-05-28 |
| RE32309 | Fusible powdered metal paste | — | 1986-12-16 |
| 4619715 | Fusible powdered metal paste | — | 1986-10-28 |
| 4557767 | Fusible powdered metal paste | — | 1985-12-10 |
| 4541876 | Nonaqueous powdered metal paste composition | — | 1985-09-17 |
| 4460414 | Solder paste and vehicle therefor | — | 1984-07-17 |