Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084374 | Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method | Frank Gindele, Christian Rakobrandt, Robert Hettler, Takahisa Uchida | 2024-09-10 |
| 10468801 | Terminal, terminal-equipped housing, and terminal attaching method | Akira Okuno, Tetsushi Morikawa, Tarou Hirai, Masahiro Taketomi, Yoshinaga Hamaguchi | 2019-11-05 |