Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6993446 | Method and apparatus for predicting the time to failure of electronic devices at high temperatures | Ruvinda Gunawardana | 2006-01-31 |
| 5536908 | Lead-free printed circuit assembly | Lawrence E. Tawyea | 1996-07-16 |