Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5183553 | Method of forming a high temperature resistant copper coating on an inorganic dielectric | Martin Bock, Kurt Heymann, Martin Rimkus | 1993-02-02 |
| 4869926 | Method of production galvanically deposited aluminum layers for use as contacts of microcircuits | Martin Bock | 1989-09-26 |