Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7709941 | Resin-sealed semiconductor device and method of manufacturing the same | Toshikazu Imaoka, Takeshi Yamaguchi, Ryosuke Usui, Hiroyuki Watanabe, Atsushi Kato | 2010-05-04 |
| 7224066 | Bonding material and circuit device using the same | Yoshihiro Kogure, Takayuki Hasegawa, Hajime Kobayashi | 2007-05-29 |
| 7199468 | Hybrid integrated circuit device with high melting point brazing material | Nobuhisa Takakusaki, Hajime Kobayashi | 2007-04-03 |
| 6259157 | Hybrid integrated circuit device, and method of manufacturing thereof | Noriaki Sakamoto, Hidefumi Saito, Hisashi Shimizu | 2001-07-10 |
| 5838070 | Apparatus having a substrate and electronic circuit solder-connected with the substrate | Noriaki Sakamoto | 1998-11-17 |