TS

Takao Shibuya

SC Sanyo Electric Co.: 10 patents #506 of 6,347Top 8%
TC Taiyo Yuden Co.: 5 patents #261 of 959Top 30%
DY Dynax: 2 patents #8 of 50Top 20%
KC Kanto Sanyo Semiconductor Co.: 1 patents #29 of 51Top 60%
Nissan Motor Co.: 1 patents #4,519 of 8,689Top 55%
Overall (All Time): #270,948 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
11837400 Electronic component surface-mountable on circuit board Takayuki SEKIGUCHI, Tsuyoshi Ogino 2023-12-05
10804016 Electronic component surface-mountable on circuit board Takayuki SEKIGUCHI, Tsuyoshi Ogino 2020-10-13
10658098 Electronic component surface-mountable on circuit board Takayuki SEKIGUCHI, Tsuyoshi Ogino 2020-05-19
10418162 Electronic component surface-mountable on circuit board Takayuki SEKIGUCHI, Tsuyoshi Ogino 2019-09-17
10090089 Electronic component surface-mountable on circuit board Takayuki SEKIGUCHI, Tsuyoshi Ogino 2018-10-02
6919624 Semiconductor device with exposed electrodes Takayuki Tani 2005-07-19
6784523 Method of fabricating semiconductor device Takayuki Tani, Haruo Hyoudo 2004-08-31
6737285 Semiconductor device manufacturing method Koji Iketani, Takayuki Tani, Haruo Hyodo 2004-05-18
6511864 Method of fabricating semiconductor device Haruo Hyoudo, Takayuki Tani 2003-01-28
6451628 Method fabricating a semiconductor device with a decreased mounting area Takayuki Tani, Haruo Hyodo 2002-09-17
6368893 Method of fabricating semiconductor device Takayuki Tani, Haruo Hyoudo 2002-04-09
6326232 Method of fabricating semiconductor device Takayuki Tani, Haruo Hyoudo 2001-12-04
6309911 Method of fabricating semiconductor device Haruo Hyoudo, Takayuki Tani 2001-10-30
6197616 Method of fabricating semiconductor device Haruo Hyoudo, Takayuki Tani 2001-03-06
6121168 Wet type paper friction material with combined improved friction characteristics and compression fatigue strength Maki Irifune, Tetsuya Ishitani, Makoto Maeda, Nobutaka Chiba, Yasuhiro Murakami 2000-09-19
6080602 Method of producing a semiconductor device using a reduced mounting area Takayuki Tani, Haruo Hyodo 2000-06-27
5109966 Mating plate in friction engagement device Kazuhito Mukai 1992-05-05