Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5300459 | Method for reducing thermal stress in an encapsulated integrated circuit package | Naoyuki Kuroe | 1994-04-05 |
| 4927069 | Soldering method capable of providing a joint of reduced thermal resistance | Yasuhiro Iwasa, Yukinori Yamaji | 1990-05-22 |