Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8575748 | Wafer-level packaging with compression-controlled seal ring bonding | — | 2013-11-05 |
| 6682607 | Reconditioning of semiconductor substrates to remove photoresist during semiconductor device fabrication | — | 2004-01-27 |
| 5783340 | Method for photolithographic definition of recessed features on a semiconductor wafer utilizing auto-focusing alignment | Stephen Montague, Jeffry J. Sniegowski, James H. Smith, Paul McWhorter | 1998-07-21 |