Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12336112 | High aspect ratio vias filled with liquid metal fill | Christopher David Bohn, Mark Crain, Justin Roehm, Nathan Robertson, Jeremy Brown +4 more | 2025-06-17 |
| 12100647 | Electrically conductive vias and methods for producing same | Alan D. Nolet, Andrew Haynes LIOTTA, Troy B. Holland, Heidi Bates, Daniel V. Goia +6 more | 2024-09-24 |