Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084847 | Prefabricated lead frame and bonding method using the same | Lei Wang, Jai Sung Lee, Qian Wang | 2011-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084847 | Prefabricated lead frame and bonding method using the same | Lei Wang, Jai Sung Lee, Qian Wang | 2011-12-27 |