Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159095 | Method of designing interconnect structure of semiconductor apparatus and method of manufacturing semiconductor apparatus using the same | Joonnyung Lee, Yeongjun KWON, Jaeyong Shin, Jeonghoon Ahn | 2024-12-03 |
| 12107034 | Semiconductor chip and semiconductor package including same | Shaofeng Ding, Sungwook Moon, Jeonghoon Ahn | 2024-10-01 |
| 11429777 | Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same | Wonji Park, Jeonghoon Ahn, Jihyung Kim, JaeHee Oh, Minguk Kang | 2022-08-30 |