Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12321611 | Memory device, memory system, and method of operating the memory system | Eun Chu Oh, Junyeong Seok, Byungchul Jang | 2025-06-03 |
| 12288590 | Storage devices and methods of operating storage devices | Eun Chu Oh, Junyeong Seok, Wijik Lee, Byungchul Jang | 2025-04-29 |
| 12249376 | Storage devices and methods of operating storage devices | Eun Chu Oh, Junyeong Seok, Byungchul Jang | 2025-03-11 |
| 12154646 | Method of reprogramming data in nonvolatile memory device, method of programming data in nonvolatile memory device, nonvolatile memory device performing the same, and method of operating nonvolatile memory device using the same | Junyeong Seok, Eunchu Oh | 2024-11-26 |
| 12125534 | Storage device using wafer-to-wafer bonding and method of manufacturing the same | Junyeong Seok, Eun Chu Oh, Byungchul Jang | 2024-10-22 |
| 12094535 | Nonvolatile memory devices for reducing degradation due to difference of threshold voltage distributions between outer cells and inner cells | Eun Chu Oh, Junyeong Seok | 2024-09-17 |
| 12056007 | Storage devices and methods of operating storage devices | Eun Chu Oh, Junyeong Seok, Byungchul Jang | 2024-08-06 |
| 12033706 | Method of operating nonvolatile memory device, nonvolatile memory device and memory controller performing the same | Junyeong Seok, Eunchu Oh, Byungchul Jang, Joonsung Lim | 2024-07-09 |
| 11989091 | Memory system for performing recovery operation, memory device, and method of operating the same | Byungchul Jang, Junyeong Seok, Eun Chu Oh | 2024-05-21 |
| 11901321 | Three-dimensional (3D) storage device using wafer-to-wafer bonding | Eun Chu Oh, Junyeong Seok, Byungchul Jang, Joonsung Lim | 2024-02-13 |