Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8420945 | Package substrate, semiconductor package having the package substrate | — | 2013-04-16 |
| 7850087 | Semiconductor device and method of manufacturing the same | Sung-Dae Cho | 2010-12-14 |
| 7502231 | Thin printed circuit board for manufacturing chip scale package | Ho Jin, Hwan Young Jang | 2009-03-10 |
| 7323642 | Thin printed circuit board for manufacturing chip scale package | Ho Jin, Hwan Young Jang | 2008-01-29 |
| 6653727 | Semiconductor chip package with direction-flexible mountability | Sang Woo Kim | 2003-11-25 |