Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486556 | Interconnection layer layout comprising cut-out conductive lines that ensure proper profile of overlying passivation layer | Kweon-Jae Lee | 2002-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486556 | Interconnection layer layout comprising cut-out conductive lines that ensure proper profile of overlying passivation layer | Kweon-Jae Lee | 2002-11-26 |