Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6608377 | Wafer level package including ground metal layer | Dong-Ho Lee, Min Young Son | 2003-08-19 |
| 6605876 | Semiconductor chip package and connection structure including a ground metal plane having blank patterns | Dong-Ho Lee | 2003-08-12 |