Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7631795 | System and method for automated wire bonding | Byung Soo Kim, Suk-Chun Jung, Kook-Jin Oh, Young-Han Kwon | 2009-12-15 |
| 6971863 | Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent | Kyung Soo Park, Hoon Chang, Sung-Soo Lee | 2005-12-06 |
| 5851853 | Method of attaching a die onto a pad of a lead frame | Hwa Young Lee, Jong Keun Jun, Jae Won Lee | 1998-12-22 |