Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960822 | Package on package substrate | Yoon Hee Kim | 2011-06-14 |
| 7065869 | Method for plating of printed circuit board strip | Sang Kab Park, Kwang-Ho Yoon, Bong Kyu Choi | 2006-06-27 |