Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7443024 | Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same | Dong Hyun Park, Yeong Gyu Lee | 2008-10-28 |
| 7394139 | Optical modulator module package using flip-chip mounting technology | Heung Woo Park, Yeong Gyu Lee, Chang-Su Park, Ohk Kun Lim | 2008-07-01 |
| 7388282 | Micro-electro-mechanical system (MEMS) package having hydrophobic layer | Yeong Gyu Lee | 2008-06-17 |
| 7368816 | Micro-electro-mechanical system (MEMS) package having metal sealing member | Ohk Kun Lim | 2008-05-06 |
| 7319553 | Optical modulator module package structure | — | 2008-01-15 |
| 7113689 | Microelectromechanical systems (MEMS) variable optical attenuator | Yoon Shik Hong, Young Gyu Lee, Sung Cheon Jung, Sang Kee YOON, Hyun Kee Lee +2 more | 2006-09-26 |
| 7078804 | Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same | Yeong Gyu Lee, Heung Woo Park | 2006-07-18 |
| 6915033 | Multi-channel optical switch and method for manufacturing the same | Yeong Gyu Lee | 2005-07-05 |
| 6901204 | Microelectromechanical system (MEMS) variable optical attenuator | Yoon Shik Hong, Sang Kee YOON, Young Gyu Lee, Sung Cheon Jung, Jung-hyun Lee | 2005-05-31 |