Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6552438 | Integrated circuit bonding pads including conductive layers with arrays of unaligned spaced apart insulating islands therein and methods of forming same | Soo-Cheol Lee, Jong-Hyon Ahn, Kyoung-Mok Son, Heon-Jong Shin, Hyae-Ryoung Lee +3 more | 2003-04-22 |