SY

Sang Hyun Yi

Samsung: 12 patents #11,258 of 75,807Top 15%
MI Mosaid Technologies Incorporated: 2 patents #86 of 170Top 55%
CM Conversant Intellectual Property Management: 1 patents #35 of 73Top 50%
Overall (All Time): #315,221 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
11705884 Bulk acoustic resonator Chang Hyun Lim, Yong Suk Kim, Sung Jun Lee, Jae-Hyoung Gil, Dong Hyun Park 2023-07-18
11430617 Electronic device and electronic device manufacturing method Jong Min Choi, Hyuk Jae Jang, Woong-Chan Kim, Jung Tae Kim, Dae-Hyeong Park +7 more 2022-08-30
10992281 Bulk acoustic wave resonator and method of manufacturing the same Yong Suk Kim, Moon-chul Lee, Sung Jun Lee, Chang Hyun Lim, Jae-Hyoung Gil 2021-04-27
10910170 Electronic device and electronic device manufacturing method Jong Min Choi, Hyuk Jae Jang, Woong-Chan Kim, Jung Tae Kim, Dae-Hyeong Park +7 more 2021-02-02
10790798 Acoustic resonator and method for manufacturing the same Jeong Suong YANG, Ho Joon Park, Yeong Gyu Lee 2020-09-29
10715099 Bulk acoustic wave resonator and method for manufacturing the same Je Hong KYOUNG, Jin Suk Son, Hwa Sun Lee 2020-07-14
10340882 Bulk acoustic wave filter 2019-07-02
9232680 Frame structure for preventing deformation, and electronic device including the same Byoung-Uk Yoon, Ho-Eun Hwang, Jae Woo Lee 2016-01-05
8946897 Semiconductor device having metal lines with slits Young-Nam Kim 2015-02-03
8673622 Cell chip and method for manufacturing the same Dong Woo Lee, Bo Sung Ku 2014-03-18
8421229 Semiconductor device having metal lines with slits Young-Nam Kim 2013-04-16
7863746 Semiconductor device having metal lines with slits Young-Nam Kim 2011-01-04
7847403 Semiconductor device having no cracks in one or more layers underlying a metal line layer Young-Nam Kim 2010-12-07
7233070 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same Young-Nam Kim 2007-06-19
6777806 Semiconductor device having no cracks in one or more layers underlying a metal line layer and method of manufacturing the same Young-Nam Kim 2004-08-17