Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6004867 | Chip-size packages assembled using mass production techniques at the wafer-level | Young Rae CHO | 1999-12-21 |
SK
Sam Il Kim
Overall (All Time): #3,671,994 of 4,157,543Top 90%
1
Patents All Time