Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594505 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Tae Ho Ko, Dae Hee Lee, Hyun Chul Jung | 2023-02-28 |
| 11114397 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Tae Ho Ko, Dae Hee Lee, Hyun Chul Jung | 2021-09-07 |
| 10026681 | Fan-out semiconductor package | Tae Ho Ko, Dae Hee Lee, Bong-Soo Kim, Do Young Jeong, Joon Seok Oh | 2018-07-17 |
| 8840967 | Method for manufacturing printed circuit board including flame retardant insulation layer | Jae Choon Cho, Hwa Young Lee, Hee Sun Chun, Choon Keun Lee | 2014-09-23 |
| 8216503 | Method for manufacturing printed circuit board using imprinting | Jae Choon Cho, Senug-Hyun Ra, Hyuk Lee, Jeong Bok Kwak, Jung Woo Lee +2 more | 2012-07-10 |
| 8187518 | Method for manufacturing substrate by imprinting | Choon Keun Lee, Seung Heon Han, Senug-Hyun Ra | 2012-05-29 |
| 7653990 | Manufacturing method of printed circuit board using an ink jet | Choon Keun Lee, Senug-Hyun Ra | 2010-02-02 |