Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198856 | Electronic component, bonding portion regions thereon, mounted on a board | Sang Yeop Kim, Eun-Ji Kim, Do Hyun An | 2025-01-14 |
| 7292430 | Multi-layer chip capacitor | Byoung Hwa Lee, Chang Hoon Shim, Dong Seok Park, Sang Soo Park, Min Cheol Park | 2007-11-06 |