Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400998 | Semiconductor package including plurality of semiconductor chips and method for manufacturing the same | Dongkwan Kim | 2025-08-26 |
| 11935868 | Semiconductor package including plurality of semiconductor chips and method for manufacturing the same | Dongkwan Kim | 2024-03-19 |
| 11908727 | Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same | Seung Hwan Lee | 2024-02-20 |
| 11631608 | Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same | Seung Hwan Lee | 2023-04-18 |
| 10825710 | Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same | Seung Hwan Lee | 2020-11-03 |
| 10665571 | Semiconductor package | — | 2020-05-26 |
| 10256215 | Semiconductor package | — | 2019-04-09 |
| 9941252 | Semiconductor package | — | 2018-04-10 |