Kunmo Chu — 6 Patents at Samsung

Kunmo Chu has been granted 6 US patents while listed as an inventor at Samsung. The first was granted in 2017 and the most recent in July 2025. Kunmo Chu ranks #779,687 of 4,157,543 US inventors in our database (top 18.8%). Patent records list Kunmo Chu in Seoul, KR.

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Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date
12370632	Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure	Junghoon Lee	2025-07-29
12288765	Hybrid bonding structures, semiconductor devices having the same, and methods of manufacturing the semiconductor devices	Byonggwon Song, Junghoon Lee	2025-04-29
11804462	Hybrid bonding structures and semiconductor devices including the same	Junghoon Lee, Byonggwon Song	2023-10-31
10392518	Paste material, wiring member formed from the paste material, and electronic device including the wiring member	Byonggwon Song, Sunghoon Park, Kiyeon YANG, Changseung LEE	2019-08-27
10249604	Semiconductor device and method of manufacturing the same	Changyoul Moon, Sunghee Lee, Junsik HWANG	2019-04-02
9831211	Anisotropic conductive material, electronic device including anisotropic conductive material, and method of manufacturing electronic device	Wonsuk Chang, Chanmoon Chung	2017-11-28

Kunmo Chu — 6 Patents

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