Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431212 | Row decoder circuit, memory device and memory system | Jungmin Bak, Changhwi Park | 2025-09-30 |
| 12347510 | Bonding defect detection for die-to-die bonding in memory devices | Jungmin Bak, Changhwi Park | 2025-07-01 |
| 12308083 | Volatile memory devices and methods of operating same to improve reliability | Jungmin Bak, Changhwi Park | 2025-05-20 |
| 12230312 | Memory device and defense method thereof | Changhwi Park, Jungmin Bak | 2025-02-18 |
| 12204772 | Memory devices and methods for managing use history | Changhwi Park, Jungmin Bak | 2025-01-21 |
| 12131798 | Non-volatile memory device for detecting defects of bit lines and word lines | Sangwan Nam, Youse Kim, Heewon KIM | 2024-10-29 |
| 11798626 | Nonvolatile memory device and method of operating a nonvolatile memory | Chaehoon Kim, Sangwan Nam, Minjae Seo, Jiwon Seo, Hojun Lee | 2023-10-24 |
| 11474149 | Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the same | Chansik Kwon, Jongkeun Moon, Jinduck Park, Jiyeon Han | 2022-10-18 |
| 11475956 | Nonvolatile memory device and method of operating a nonvolatile memory | Chaehoon Kim, Sangwan Nam, Minjae Seo, Jiwon Seo, Hojun Lee | 2022-10-18 |
| 11373942 | Semiconductor devices | Senyun Kim, YoungHoon Ro | 2022-06-28 |
| 10629564 | Removal apparatuses for semiconductor chips | Jaeyong Park, Whasu Sin, Kyhyun Jung | 2020-04-21 |
| 10121774 | Method of manufacturing a semiconductor package | — | 2018-11-06 |
| 9768141 | Removal apparatuses for semiconductor chips | Jaeyong Park, Whasu Sin, Kyhyun Jung | 2017-09-19 |
| 8998068 | Removal apparatuses for semiconductor chips | Jaeyong Park, Whasu Sin, Kyhyun Jung | 2015-04-07 |
| 8866295 | Semiconductor memory modules and methods of fabricating the same | Young-Ja Kim, Daesang Chan | 2014-10-21 |
| 8757134 | Wafer dicing blade and wafer dicing apparatus including the same | Young-Ja Kim | 2014-06-24 |
| 8749044 | Semiconductor memory modules and methods of fabricating the same | Young-Ja Kim, Daesang Chan | 2014-06-10 |