Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7429794 | Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip | Byeong-Yun Kim, Young-Dae Kim | 2008-09-30 |
| 7224176 | Semiconductor device having test element groups | Eun-Han Kim | 2007-05-29 |
| 6949837 | Bonding pad arrangement method for semiconductor devices | Ho-Cheol Lee, Jae Hoon Kim | 2005-09-27 |