Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791298 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Han KIM | 2023-10-17 |
| 11657968 | Multilayer capacitor and board having the same | Hyung Joon Kim | 2023-05-23 |
| 11164838 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Han KIM | 2021-11-02 |
| 11069666 | Semiconductor package | Chui Kyu Kim, Dae-Hyun Park, Jae Hyun Lim, Mi-Ja Han, Sang Jong Lee +1 more | 2021-07-20 |
| 10957670 | Package-on-package and package connection system comprising the same | Hyung Joon Kim, Seok Hwan Kim, Sung Il Jo | 2021-03-23 |
| 10685926 | Antenna module | Jae Hyun Lim, Han Kim, Chul Kyu KIM, Sang Jong Lee | 2020-06-16 |
| 10672727 | Semiconductor package providing protection from electrical noise | Hyung Joon Kim, Jun Young Won, Han KIM | 2020-06-02 |
| 10553541 | Fan-out semiconductor package | Hyung Joon Kim, Dae-Hyun Park, Han Kim | 2020-02-04 |
| 10325891 | Fan-out semiconductor package and package on package including the same | Jae Hyun Lim, Han Kim, Eun Jung Jo, Sang Jong Lee, Hyung Joon Kim | 2019-06-18 |
| 10262949 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-04-16 |
| 10256200 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-04-09 |
| 10199337 | Electronic component package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2019-02-05 |
| 10157851 | Fan-out semiconductor package | Hyung Joon Kim, Dae-Hyun Park, Han Kim | 2018-12-18 |
| 10096552 | Fan-out semiconductor package | Han Kim, Eun Jung Jo | 2018-10-09 |
| 9984979 | Fan-out semiconductor package and method of manufacturing the same | Dae-Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko | 2018-05-29 |