Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456202 | Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup head | Jin-San Jung, Hyunseok CHOI | 2022-09-27 |
| 10991597 | Method of fabricating a semiconductor device using an adhesive layer | Kyung Hak Lee, Jaeyong Park, Sungil Cho | 2021-04-27 |
| 10886248 | Laser bonding apparatus, method of bonding semiconductor devices, and method of manufacturing semiconductor package | Satoshi Inada | 2021-01-05 |