Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7893792 | Duplexer using an embedded PCB and method of fabricating the same | Yun Kwon Park, Il-jong Song, Byeoung-ju Ha | 2011-02-22 |
| 7793395 | Method for manufacturing a film bulk acoustic resonator | Byeoung-ju Ha, Yun Kwon Park, In-sang Song, Il-jong Song, Jong Seok Kim +1 more | 2010-09-14 |
| 7755151 | Wafer level package for surface acoustic wave device and fabrication method thereof | Ji-hyuk Lim, Woon-bae Kim, Suk Jin Ham, Jong-oh Kwon, Moon-chul Lee +1 more | 2010-07-13 |
| 7675154 | RF module with multi-stack structure | Seog-woo Hong, In-sang Song, Byeong-ju Ha, Hae-seok Park, Joo-ho Lee | 2010-03-09 |
| 7626258 | Cap wafer, semiconductor chip having the same, and fabrication method thereof | Ji-hyuk Lim, Woon-bae Kim | 2009-12-01 |
| 7579685 | Wafer level packaging cap and fabrication method thereof | Moon-chul Lee, Woon-bae Kim, Kae-dong Back, Qian Wang, Kyu-dong Jung | 2009-08-25 |
| 7545017 | Wafer level package for surface acoustic wave device and fabrication method thereof | Moon-chul Lee, Ji-hyuk Lim, Woon-bae Kim | 2009-06-09 |
| 7510968 | Cap for semiconductor device package, and manufacturing method thereof | Moon-chul Lee, Jong-oh Kwon, Kae-dong Back, Qian Wang, Kyu-dong Jung | 2009-03-31 |
| 7452809 | Fabrication method of packaging substrate and packaging method using the packaging substrate | Moon-chul Lee, Woon-bae Kim, Chang-youl Moon | 2008-11-18 |
| 7449366 | Wafer level packaging cap and fabrication method thereof | Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Ji-hyuk Lim, Suk Jin Ham +1 more | 2008-11-11 |
| 7417525 | High efficiency inductor, method for manufacturing the inductor, and packaging structure using the inductor | Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Chang-youl Moon, In-sang Song | 2008-08-26 |
| 7408257 | Packaging chip and packaging method thereof | Kyu-dong Jung, Woon-bae Kim, In-sang Song, Moon-chul Lee, Suk Jin Ham | 2008-08-05 |
| 7408434 | Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package | Moon-chul Lee, Jong-oh Kwon, Woon-bae Kim, Jea Shik Shin, Eun Sung Lee | 2008-08-05 |
| 7372261 | Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same | Won-youl Choi, Sang-on Choi, Myung Sam Kang | 2008-05-13 |
| 7335974 | Multi stack packaging chip and method of manufacturing the same | Woon-bae Kim, Chang-youl Moon, Moon-chul Lee, Kyu-dong Jung | 2008-02-26 |
| 7253703 | Air-gap type FBAR, method for fabricating the same, and filter and duplexer using the same | In-sang Song, Yun Kwon Park, Byeoung-ju Ha | 2007-08-07 |
| 7205702 | Film bulk acoustic resonator and method for manufacturing the same | Byeoung-ju Ha, Yun Kwon Park, In-sang Song, Il-jong Song, Jong Seok Kim +1 more | 2007-04-17 |
| 7041526 | Magnetic field detecting element and method for manufacturing the same | Dong-sik Shim, Kyung-won Na, Sang-on Choi, Hae-seok Park | 2006-05-09 |
| 6423473 | Fabrication method of high temperature superconducting step-edge Josephson junction | Gun Yong Sung, Kwang Yong Kang | 2002-07-23 |