Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887892 | Method for forming semiconductor die with die region and seal-ring region | Jin Won Jeong, Jang-Hee Lee, Young Hun JUN, Jae Sik Choi | 2024-01-30 |
| 10535575 | Interposer, method of manufacturing interposer, and method of manufacturing semiconductor package | Shaofeng Ding, Kyoung-Woo Lee, In Hwan Kim | 2020-01-14 |
| 9373602 | Wire structure and semiconductor device having the same, and method of manufacturing the wire structure | Eun Kyung Lee, Byoung-lyong Choi, Won Jae Joo, Byung Sung Kim, Jae Hyun Lee +1 more | 2016-06-21 |
| 5917715 | Forward converter having an improved power factor and suppressing a harmonic noise component of an input current waveform | — | 1999-06-29 |
| 5123580 | Key holder | — | 1992-06-23 |